5 Must-Have Features in a Magnetron Sputtering Film

Rectangular Target

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For rectangular target we will have the following assumptions to investigate the relation between thickness uniformity and target erosion area:

Here We consider copper as the target material and argon as the sputter gas. The energy of dispersed copper atoms is usually reported to be less than 10 eV. Therefore, the free mean length for copper atoms is equal to:

λcu=3.45×10^(-4)×(T/P)

For a temperature of 300 K and a pressure of 1 to 5 Pascals, the free mean path of copper atoms is 21 to 138 mm.

Considering the percentage length as the ratio between the length of uniform area on the substrate and the substrate length to judge the thin film thickness uniformity under different target conditions. The uniform area is an area where the thin film thickness has less than 5% non-uniformity.

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Length percent=(The length of uniform deposition zone on the substrate/The substrate length)

Deposition Techniques

There are numerous deposition methods to create thin films of different materials on various substrates with innumerable structures. These methods are divided into two main categories: Chemical and Physical methods.

• Chemical Deposition

In chemical deposition, the reaction of a precursor fluid on the substrate results in the formation of a thin layer on the solid. Electroplating, sol-gel, dip coating, spin coating, chemical vapor deposition (CVD), plasma enhanced CVD (PECVD), and atomic layer deposition (ALD) are popular chemical deposition methods.

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